JPH0224395B2 - - Google Patents
Info
- Publication number
- JPH0224395B2 JPH0224395B2 JP59148270A JP14827084A JPH0224395B2 JP H0224395 B2 JPH0224395 B2 JP H0224395B2 JP 59148270 A JP59148270 A JP 59148270A JP 14827084 A JP14827084 A JP 14827084A JP H0224395 B2 JPH0224395 B2 JP H0224395B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- core wiring
- wiring board
- metal core
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000011810 insulating material Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 229920003023 plastic Polymers 0.000 abstract description 4
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 239000012778 molding material Substances 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14827084A JPS6127665A (ja) | 1984-07-17 | 1984-07-17 | メタルコア配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14827084A JPS6127665A (ja) | 1984-07-17 | 1984-07-17 | メタルコア配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127665A JPS6127665A (ja) | 1986-02-07 |
| JPH0224395B2 true JPH0224395B2 (en]) | 1990-05-29 |
Family
ID=15449008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14827084A Granted JPS6127665A (ja) | 1984-07-17 | 1984-07-17 | メタルコア配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127665A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6222497A (ja) * | 1985-07-22 | 1987-01-30 | 東洋通信機株式会社 | メタルコア配線基板 |
| CH691020A5 (de) * | 1996-01-15 | 2001-03-30 | Fela Holding Ag | Verfahren zur Herstellung von spritzgegossenen dreidimensionalen Leiterformkörpern. |
| KR101231296B1 (ko) | 2006-09-25 | 2013-02-07 | 엘지이노텍 주식회사 | 인텔리전트 파워 모듈 |
| JP5455468B2 (ja) * | 2009-06-30 | 2014-03-26 | 矢崎総業株式会社 | メタルコア基板用基材及び該メタルコア基板用基材を用いたメタルコア基板の製造方法 |
-
1984
- 1984-07-17 JP JP14827084A patent/JPS6127665A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6127665A (ja) | 1986-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0065425A2 (en) | Hybrid integrated circuit component and printed circuit board mounting said component | |
| EP0250006A1 (en) | Printed polymer circuit board method and apparatus | |
| US4845313A (en) | Metallic core wiring substrate | |
| JPH06216487A (ja) | フレキシブルパターンの接続端子部 | |
| JPH04346289A (ja) | 印刷配線板 | |
| US4164071A (en) | Method of forming a circuit board with integral terminals | |
| JP3226959B2 (ja) | 多層フレキシブルプリント基板の製法 | |
| JPH0224395B2 (en]) | ||
| WO1990007857A1 (en) | Metal core wiring board | |
| JPH0528918B2 (en]) | ||
| JPS5814621Y2 (ja) | プリント配線基板 | |
| JPS5830189A (ja) | 微小回路素子の製造法 | |
| EP0835046B1 (en) | Component mounting board, process for producing the board, and process for producing the module | |
| JP2891938B2 (ja) | 電気部品の接続方法 | |
| JP3110329B2 (ja) | 電子部品の半田付け方法 | |
| JP2000299544A (ja) | リジッド回路基板の接続構造 | |
| JPH0536300Y2 (en]) | ||
| JPH0347341Y2 (en]) | ||
| JP2603863B2 (ja) | プリント配線板 | |
| JPH11145602A (ja) | プリント配線基板 | |
| JPS63244696A (ja) | 複合回路基板の製造方法 | |
| JPH03255691A (ja) | プリント配線板 | |
| JPH04158596A (ja) | 電子部品実装方法 | |
| JPH0822853A (ja) | ピンアサイメント変更用プリント基板 | |
| JP2000323837A (ja) | 多層印刷配線基板の製造方法 |